Semiconductor chip

ABSTRACT

A semiconductor chip includes a semiconductor substrate including a bump region and a non-bump region, a bump on the bump region, and a passivation layer on the bump region and the non-bump region of the semiconductor substrate. No bump is on the non-bump region. A thickness of the passivation layer in the bump region is thicker than a thickness of the passivation layer in the non-bump region. The passivation layer includes a step between the bump region and the non-bump region.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 U.S.C. § 119 to Korean PatentApplication No. 10-2016-0151306, filed on Nov. 14, 2016, in the KoreanIntellectual Property Office, the disclosure of which is incorporatedherein in its entirety by reference.

BACKGROUND

Inventive concepts relate to a semiconductor chip, and moreparticularly, to a semiconductor chip capable of improving reliability.

As the diameter of a semiconductor substrate (or semiconductor wafer)increases and the degree of integration of a semiconductor chipincreases, reliability of semiconductor manufacturing processes or asemiconductor chip may degrade. Accordingly, efforts are being made toimprove reliability of the semiconductor manufacturing processes and/orthe semiconductor chip.

SUMMARY

Inventive concepts provide a semiconductor chip having improvedreliability.

According to some example embodiments of inventive concepts, asemiconductor chip includes a semiconductor substrate including a bumpregion and a non-bump region, a bump on the bump region and the non-bumpregion having no bump, and a passivation layer on the bump region andthe non-bump region of the semiconductor substrate. A thickness of thepassivation layer at the bump region is thicker than a thickness of thepassivation layer at the non-bump region, and the passivation layerincludes a step between the bump region and the non-bump region.

According to some example embodiments of inventive concepts, asemiconductor chip includes a semiconductor substrate, a via, a bump,and a passivation layer. The semiconductor substrate includes a bumpregion and a non-bump region. The via is in the bump region. Thepassivation layer is on the bump region and the non-bump region of thesemiconductor substrate. A thickness of the passivation layer at thebump region is thicker than a thickness of the passivation layer at thenon-bump region, and the passivation layer includes a step between thebump region and the non-bump region.

According to some example embodiments of inventive concepts, asemiconductor chip includes a semiconductor substrate including a firstsurface opposite a second surface, a bump pad, a bump, and a passivationlayer. The semiconductor substrate includes a bump region, a non-bumpregion, a redistribution wiring region, and a dummy region. The bump padis on the first surface of the substrate in the bump region. The bump ison the bump pad.

The non-bump region has no bump. At least one of a redistribution wiringpattern on the redistribution wiring region and a dummy pattern on thedummy region are on the first surface or the second surface of thesemiconductor substrate. The passivation layer covers the bump region,the non-bump region, and the redistribution wiring and dummy regions onthe first surface or the second surface of the semiconductor substrate.A thickness of the passivation layer at the bump region is thicker thana thickness of the passivation layer at the non-bump region, and thepassivation layer includes a first step between the bump region and thenon-bump region.

According to some example embodiments of inventive concepts, asemiconductor chip includes a semiconductor substrate including a firstsurface opposite a second surface, a bump connected to one of the firstsurface and the second surface, and a passivation layer on thesemiconductor substrate. The passivation layer extends along the one ofthe first surface and the second surface of the semiconductor substrate.The passivation layer includes a first portion having a first thickness,a second portion having a second thickness that is less than the firstthickness, and a step defining the first portion and the second portion.The first portion of the passivation layer defines a hole between thebump and the semiconductor substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

Inventive concepts will be more clearly understood from the followingdetailed description of non-limiting embodiments taken in conjunctionwith the accompanying drawings in which:

FIG. 1 is a partial cross-sectional view of a semiconductor chipaccording to some example embodiments of inventive concepts;

FIG. 2 is a partial cross-sectional view of a semiconductor chipaccording to some example embodiments of inventive concepts;

FIG. 3 is a partial cross-sectional view of a semiconductor chipaccording to some example embodiments of inventive concepts;

FIG. 4 is a partial cross-sectional view of a semiconductor chipaccording to some example embodiments of inventive concepts;

FIG. 5 is a partial cross-sectional view of a semiconductor chipaccording to some example embodiments of inventive concepts;

FIG. 6 is a partial cross-sectional view of a semiconductor chipaccording to some example embodiments of inventive concepts;

FIG. 7 is a partial cross-sectional view of a semiconductor chipaccording to some example embodiments of inventive concepts;

FIG. 8 is a partial cross-sectional view of a semiconductor chipaccording to some example embodiments of inventive concepts;

FIG. 9 is a partial cross-sectional view of a semiconductor chipaccording to some example embodiments of inventive concepts;

FIG. 10 is a partial cross-sectional view of a semiconductor chipaccording to some example embodiments of inventive concepts;

FIG. 11 is a partial cross-sectional view of a semiconductor chipaccording to some example embodiments of inventive concepts;

FIGS. 12 and 13 are plan views partially showing a semiconductor chipillustrating a relationship between thicknesses of a bump and apassivation layer, according to some example embodiments of inventiveconcepts;

FIG. 14 is partially plan views of a semiconductor chip illustrating arelationship between thicknesses of a bump and a passivation layer,according to some example embodiments of inventive concepts;

FIG. 15 is partially plan views of a semiconductor chip illustrating arelationship between thicknesses of a bump and a passivation layer,according to some example embodiments of inventive concepts;

FIG. 16 is a cross-sectional view of a semiconductor package including asemiconductor chip according to some example embodiments of inventiveconcepts;

FIG. 17 is a partially enlarged view of FIG. 16;

FIG. 18 is a partially enlarged cross-sectional view of thesemiconductor chip of FIG. 16;

FIG. 19 is a cross-sectional view of a semiconductor package including asemiconductor chip according to some example embodiments of inventiveconcepts;

FIG. 20 is a cross-sectional view of a semiconductor package including asemiconductor chip according to some example embodiments of inventiveconcepts;

FIG. 21 is a partially enlarged view of FIG. 20; and

FIG. 22 is a cross-sectional view of a semiconductor package including asemiconductor chip according to some example embodiments of inventiveconcepts.

DETAILED DESCRIPTION

Hereinafter, some example embodiments of inventive concepts will bedescribed in detail with reference to the accompanying drawings. Likereference numerals in the drawings denote like elements. The followexample embodiments described below may be configured independently ofeach other or may be combined with each other.

FIG. 1 is a partial cross-sectional view of a semiconductor chip 10 aaccording to some example embodiments of inventive concepts.

In particular, the semiconductor chip 10 a may be used in a memory chip,a non-memory chip, or an interposer. The memory chip may be anon-volatile memory chip. The memory chip may be a flash memory chip,e.g., a NAND flash memory chip or a NOR flash memory chip.

The memory chip may be Phase-change Random-Access Memory (PRAM),Magneto-resistive Random-Access Memory (MRAM), or ResistiveRandom-Access Memory (RRAM). The non-memory chip may be a centralprocessing unit, multimedia semiconductor, on-demand semiconductor, orpower semiconductor. The interposer may be a chip that electricallyconnects an upper semiconductor chip and a lower semiconductor chip toeach other without including an active device.

The semiconductor chip 10 a may include a semiconductor substrate 11having a first surface F1 and a second surface F2 opposite the firstsurface F1. The second surface F2 may be opposite to the first surfaceF1 in a z-axis direction (perpendicular to a surface of thesemiconductor substrate). The semiconductor substrate 11 may include asemiconductor wafer, and may include, for example, a group-IV materialor a group III-V compound.

The semiconductor substrate 11 may be a single-crystalline wafer such asa silicon single-crystalline wafer. However, the semiconductor substrate11 is not limited to a single-crystalline wafer, and various otherwafers such as an Epi or Epitaxial wafer, a polished wafer, an annealedwafer, a silicon-on-insulator (SOI) wafer, may be used as thesemiconductor substrate 11. Here, the Epitaxial wafer denotes a wafer,in which crystalline material is grown on a single-crystalline siliconsubstrate.

The semiconductor chip 10 a may include a bump region I in which a bump20 is disposed on the first surface F1 of the semiconductor substrate11. The bump 20 included in the bump region I may be a connectionterminal for electrically connecting to an external semiconductor chipor another semiconductor chip. An active region, for example, atransistor or a wiring layer, may be formed on the first surface F1 ofthe semiconductor substrate 11. Optionally, an active region, forexample, a transistor or a wiring layer, may be formed on the secondsurface F2 of the semiconductor substrate 11. The bump region I mayinclude a via 16 penetrating through the semiconductor substrate 11 anda barrier metal pad 18 formed on the via 16.

The via 16 may be a through silicon via that penetrates through thesemiconductor substrate 11. The via 16 may be formed for electricallyconnecting to semiconductor chips located above and below thesemiconductor substrate 11. Via insulating layers 15 for insulating thesemiconductor substrate 11 and the via 16 from each other may be formedon opposite side walls of the via 16.

In the bump region I, the bump 20 may be formed on the barrier metal pad18. If the bump 20 is a solder bump, the bump 20 may maintain a ballshape due to a surface tension effect after a reflow process. However,if the bump 20 is a gold (Au) bump, the bump 20 may be formed as aplated square pillar. The bump 20 may include a metal material such assolder, gold (Au), and copper (Cu).

The bump region I may include a peripheral region extending a desired(and/or alternatively predetermined) distance from opposite side wallsof the bump 20 or the barrier metal pad 18. In FIG. 1, the bump region Imay include a peripheral region that extends a desired (and/oralternatively predetermined) distance, for example, d1 or d1-1, from theopposite side walls of the barrier metal pad 18.

The semiconductor chip 10 a may include a non-bump region II, in whichthe bump 20 is not disposed on the first surface F1 of the semiconductorsubstrate 11. The non-bump region II may be a region, except for thebump 20 and the peripheral region adjacent to the bump 20. Thesemiconductor chip 10 a may include a lower passivation layer 12 thatcovers the first surface F1 of the semiconductor substrate 11, exceptfor the via 16. The lower passivation layer 12 may be an oxide layer, anitride layer, or a combination layer thereof.

An upper passivation layer 14 may be formed on the lower passivationlayer 12, except for the via 16. The upper passivation layer 14 may bean oxide layer, a nitride layer, or a combination layer thereof. Theupper passivation layer 14 may be a photo-sensitive organic layer. Thephoto-sensitive organic layer may be a photo-sensitive polyimide layer.The upper passivation layer 14 may be an uppermost passivation layer. Avia hole ho1 exposing the via 16 may be formed in the upper passivationlayer 14. The barrier metal pad 18 may be formed on the via 16 in thevia hole ho1.

The upper passivation layer 14 may be divided as an upper passivationlayer 14 a in the bump region I and an upper passivation layer 14 b inthe non-bump region II. The upper passivation layer 14 a in the bumpregion I may extend a distance d1 and a distance d1-1 respectively froma side wall and the other side wall of the barrier metal pad 18, in anx-axis direction (horizontal direction). The bump region I may includethe upper passivation layer 14 a that extends a distance d1 and adistance d1-1 respectively from a side wall and the other side wall ofthe barrier metal pad 18, in an x-axis direction (horizontal directionwith respect to the surface of the semiconductor substrate 11). In FIG.1, the y-axis direction is perpendicular to the x-axis direction, andmay be parallel with the surface of the semiconductor substrate 11.

Although the distance d1 and the distance d-1 are shown not to be equalto each other in FIG. 1, the distance d1 and the distance d-1 may beequal to each other. When the upper passivation layer 14 a in the bumpregion I extends from the side wall and the other side wall of thebarrier metal pad 18, the bump 20 may be stably formed on the barriermetal pad 18.

A thickness t1 of the upper passivation layer 14 a of the bump region Iis thicker than a thickness t2 of the upper passivation layer 14 b inthe non-bump region II, and a step sh1 is formed between the bump regionI and the non-bump region I. The step sh1 may be obtained by forming anupper passivation material layer (not shown) on the lower passivationlayer 12, and performing a photolithography process on the upperpassivation material layer by using a mask, for example, a phase shiftmask.

The step sh1 may be formed simultaneously with the forming of the viahole ho1 exposing the via 16. The step sh1 may be formed perpendicularin the z-axis direction, or may be inclined by a desired (and/oralternatively predetermined) angle.

The thickness t2 of the upper passivation layer 14 b in the non-bumpregion II is less than the thickness t1 of the upper passivation layer14 a in the bump region I, and thus, pressure applied to a semiconductorstructure including the lower passivation layer 12 and the semiconductorsubstrate 11 is reduced and warpage of the semiconductor chip 10 a maybe reduced.

In particular, when the upper passivation layer 14 includes thephoto-sensitive organic layer, e.g., a photo-sensitive polyimide layer,and when the thickness t2 of the upper passivation layer 14 b in thenon-bump region II is thinner than the thickness t1 of the upperpassivation layer 14 a, the pressure applied to the semiconductorstructure including the lower passivation layer 12 and the semiconductorsubstrate 11 may be greatly reduced and the warpage of the semiconductorchip 10 a may be greatly decreased.

FIG. 2 is a partial cross-sectional view of a semiconductor chip 10 baccording to some example embodiments of inventive concepts.

The semiconductor chip 10 b may be nearly the same as the semiconductorchip 10 a of FIG. 1, except that the semiconductor chip 10 b includes aplurality of vias 16 and a bump pad 22. Accordingly, descriptions aboutthe same elements as those of the semiconductor chip 10 a of FIG. 1 maybe omitted or briefly provided.

The semiconductor chip 10 b includes the plurality of vias 16 in thesemiconductor substrate 11. Via insulating layers 15 for insulating thesemiconductor substrate 11 and the vias 16 from each other may be formedon opposite side walls of the vias 16. Although FIG. 2 shows two vias16, three or more vias 16 may be formed. The semiconductor chip 10 b mayinclude a bump region I in which a bump 20 is disposed on the firstsurface F1 of the semiconductor substrate 11.

The bump region I may include the vias 16 penetrating through thesemiconductor substrate 11, the bump pad 22 formed on the vias 16, andthe barrier metal pad 18 formed on the bump pad 22. The bump pad 22 maybe formed on the vias 16 and the lower passivation layer 12. The bumppad 22 may be a pad connecting all of the vias 16 to one another. Thebump pad 22 may be a metal pad.

The bump region I may include the bump 20 formed on the barrier metalpad 18 on the bump pad 22. The bump region I may include a peripheralregion extending a desired (and/or alternatively predetermined) distancefrom opposite side walls of the bump 20 or the barrier metal pad 18. InFIG. 2, the bump region I may include a peripheral region that extends adesired (and/or alternatively predetermined) distance, for example, d2or d2-1, from the opposite side walls of the barrier metal pad 18.

The semiconductor chip 10 b may include the non-bump region II, in whichthe bump 20 is not disposed on the first surface F1 of the semiconductorsubstrate 11. The semiconductor chip 10 b may include the lowerpassivation layer 12 that covers the first surface F1 of thesemiconductor substrate 11, except for the vias 16. The upperpassivation layer 14 may be formed on the lower passivation layer 12,except for the vias 16. A pad hole ho2 exposing the bump pad 22 may beformed in the upper passivation layer 14. The barrier metal pad 18 maybe formed on the bump pad 22 in the pad hole ho2.

The upper passivation layer 14 may be divided as an upper passivationlayer 14 a-1 in the bump region I and an upper passivation layer 14 b-1in the non-bump region II. The upper passivation layer 14 a-1 in thebump region I may extend a distance d2 and a distance d2-1 respectivelyfrom a side wall and the other side wall of the barrier metal pad 18, inthe x-axis direction (horizontal direction).

Although the distance d2 and the distance d2-1 are shown not to be equalto each other in FIG. 2, the distance d2 and the distance d2-1 may beequal to each other. A thickness t3 of the upper passivation layer 14a-1 of the bump region I is thicker than a thickness t4 of the upperpassivation layer 14 b-1 in the non-bump region II, and a step sh2 isformed between the bump region I and the non-bump region II.

The thickness t3 of the upper passivation layer 14 a-1 in the bumpregion I of the semiconductor chip 10 b of FIG. 1 may be thicker than athickness of the upper passivation layer 14 a of the semiconductor chip10 a of FIG. 2 due to the bump pad 22. The thickness t4 of the upperpassivation layer 14 b-1 in the non-bump region II of the semiconductorchip 10 b of FIG. 2 may be thicker than the thickness of the upperpassivation layer 14 b in the non-bump region II of the semiconductorchip 10 a of FIG. 1, due to the bump pad 22.

The step sh2 may be obtained by forming an upper passivation materiallayer (not shown) on the lower passivation layer 12, and performing aphotolithography process on the upper passivation material layer byusing a mask, for example, a phase shift mask. The step sh2 may beformed simultaneously with the forming of the pad hole ho2 exposing thebump pad 22. The step sh2 may be formed perpendicular in the z-axisdirection, or may be inclined by a desired (and/or alternativelypredetermined) angle.

FIG. 3 is a partial cross-sectional view of a semiconductor chip 10 caccording to some example embodiments of inventive concepts.

In detail, the semiconductor chip 10 c may be nearly the same as thesemiconductor chip 10 b of FIG. 2, except that the semiconductor chip 10c includes a redistribution wiring region III including a redistributionwiring pattern 32. Accordingly, descriptions about the same elements asthose of the semiconductor chip 10 a of FIG. 1 and the semiconductorchip 10 b of FIG. 2 may be omitted or briefly provided.

The semiconductor chip 10 c may include a bump region I in which a bump20 is disposed on the first surface F1 of the semiconductor substrate11. The bump region I may include vias 16, the bump pad 22, and thebarrier metal pad 18. The semiconductor chip 10 c may include theredistribution wiring region III, in which the redistribution wiringpattern 32 is formed on the lower passivation layer 12. Theredistribution wiring region III may be formed at a side of the bumpregion I. The semiconductor chip 10 c may include the non-bump regionII, in which the bump 20 is not disposed on the first surface F1 of thesemiconductor substrate 11.

The upper passivation layer 14 may be formed to cover the bump region I,the redistribution wiring region III, and the non-bump region II. Theupper passivation layer 14 may be formed on the lower passivation layer12 and cover the bump pad 22 and the redistribution wiring pattern 32.The upper passivation layer 14 may be divided as an upper passivationlayer 14 a-1 in the bump region I, an upper passivation layer 14 a-2 inthe redistribution wiring region III, and an upper passivation layer 14b-1 in the non-bump region II.

The upper passivation layers 14 a-1 and 14 a-2 in the bump region I andthe redistribution wiring region III may extend a distance d3 from aside wall of the barrier metal pad 18 in the x-axis direction(horizontal direction). The upper passivation layer 14 a-1 in the bumpregion I may extend a distance d2-1 from the other side wall of thebarrier metal pad 18 in a −x direction (horizontal direction).

The thickness t3 of the upper passivation layers 14 a-1 and 14 a-2 inthe bump region I and the redistribution wiring region III may bethicker than the thickness t4 of the upper passivation layer 14 b-1 inthe non-bump region II, and a step sh3 is formed between theredistribution wiring region III and the non-bump region II, and thestep sh2 is formed between the bump region I and the non-bump region II.

The thickness t3 of the upper passivation layers 14 a-1 and 14 a-2 inthe bump region I and the redistribution wiring region III of thesemiconductor chip 10 c of FIG. 3 may be thicker than the thickness ofthe upper passivation layer 14 a in the semiconductor chip 10 a of FIG.1 due to the bump pad 22 and the redistribution wiring pattern 32. Thethickness t4 of the upper passivation layer 14 b-1 in the non-bumpregion II of the semiconductor chip 10 c of FIG. 3 may be thicker thanthe thickness of the upper passivation layer 14 b in the non-bump regionII of the semiconductor chip 10 a of FIG. 1 due to the bump pad 22 andthe redistribution wiring pattern 32.

The steps sh2 and sh3 may be obtained by forming an upper passivationmaterial layer (not shown) on the lower passivation layer 12, andperforming a photolithography on the upper passivation material layer byusing a mask, for example, a phase shift mask. The steps sh2 and sh3 maybe formed simultaneously with the forming of the pad hole ho2 exposingthe bump pad 22. The steps sh2 and sh3 may be formed perpendicular inthe z-axis direction, or may be inclined by a desired (and/oralternatively predetermined) angle.

FIG. 4 is a partial cross-sectional view of a semiconductor chip 10 daccording to some example embodiments of inventive concepts.

In detail, the semiconductor chip 10 d may be similar to thesemiconductor chip 10 a of FIG. 1 except that the semiconductor chip 10d includes the plurality of vias 16 and the bump pad 22 on the firstsurface F1 of the semiconductor substrate 11 and includes an activeregion ac, a connection pad 28, and an external connection terminal 30on the second surface F2 of the semiconductor substrate 11. Accordingly,descriptions about the same elements as those of the semiconductor chip10 a of FIG. 1 may be omitted or briefly provided.

The semiconductor chip 10 d includes the plurality of vias 16 in thesemiconductor substrate 11. Via insulating layers 15 for insulating thesemiconductor substrate 11 and the vias 16 from each other may be formedon opposite side walls of the vias 16. Although FIG. 4 shows three vias16, four or more vias 16 may be formed. The semiconductor chip 10 d mayinclude a bump region I in which a bump 20 is disposed on the firstsurface F1 of the semiconductor substrate 11.

The bump region I may include the vias 16 penetrating through thesemiconductor substrate 11 and the bump pad 22 formed on the vias 16.The bump pad 22 may be formed on the vias 16 and the lower passivationlayer 12. The bump pad 22 may be a pad connecting all of the vias 16 toone another. The bump pad 22 may be a metal pad.

Unlike the example illustrated in FIG. 1, the bump 20 may be formed onthe bump pad 22 in the bump region I. The bump region I may include aperipheral region extending a desired (and/or alternativelypredetermined) distance from opposite side walls of the bump 20 or thebump pad 22. In FIG. 4, the bump region I may include a peripheralregion that extends a desired (and/or alternatively predetermined)distance, for example, d4 or d4-1, from the opposite side walls of thebump 20.

The semiconductor chip 10 d may include the non-bump region II, in whichthe bump 20 is not disposed on the first surface F1 of the semiconductorsubstrate 11. The semiconductor chip 10 d may include the lowerpassivation layer 12 that covers the first surface F1 of thesemiconductor substrate 11, except for the vias 16. The upperpassivation layer 14 may be formed on the lower passivation layer 12,except for the vias 16. A via hole ho3 exposing the vias 16 may beformed in the upper passivation layer 14. The bump pad 22 and the bump20 may be formed in the via hole ho3.

In FIG. 4, a thickness of the bump pad 22 is shown to be equal to thatof the upper passivation layer 14 a. However, optionally, the bump pad22 may be formed to be thinner in thickness. In addition, the bump 20may have various ball type shapes according to the reflow process asdescribed above, in a case where the bump 20 is a solder bump.

The upper passivation layer 14 may be divided as an upper passivationlayer 14 a in the bump region I and an upper passivation layer 14 b inthe non-bump region II. The upper passivation layer 14 a in the bumpregion I may extend a distance d4 and a distance d4-1 respectively froma side wall and the other side wall of the bump 20 in the x direction(horizontal direction). Although the distance d4 and the distance d4-1are shown not to be equal to each other in FIG. 4, the distance d4 andthe distance d4-1 may be equal to each other.

A thickness t1 of the upper passivation layer 14 a of the bump region Iis thicker than a thickness t2 of the upper passivation layer 14 b inthe non-bump region IL, and a step sh2 is generated between the bumpregion I and the non-bump region II. The step sh2 may be obtained byforming an upper passivation material layer (not shown) on the lowerpassivation layer 12, and performing a photolithography process on theupper passivation material layer by using a mask, for example, a phaseshift mask. The step sh2 may be formed simultaneously with the formingof the via hole ho3 exposing the vias 16.

The active region ac including a wiring layer 24 and an interlayerinsulating layer 26 may be formed on the second surface F2 of thesemiconductor substrate 11. FIG. 4 only shows the wiring layer 24 andthe interlayer insulating layer 26 as the active region ac, forconvenience of description. The connection pads 28 and the externalconnection terminals 30 may be formed on the active region ac. Thesemiconductor chip 10 d may be mounted on an external circuit board,e.g., a printed circuit board, via the external connection terminals 30.

FIG. 5 is a partial cross-sectional view of a semiconductor chip 10 eaccording to some example embodiments of inventive concepts.

In detail, the semiconductor chip 10 e may be similar to thesemiconductor chip 10 d of FIG. 4, except that the active region ac isformed on the first surface F1 of the semiconductor substrate 11 and aconnection pad 28-1 connecting the plurality of vias 16 to one anotheris formed on the second surface F2 of the semiconductor substrate 11.Accordingly, descriptions about the same elements as those of thesemiconductor chips 10 a and 10 d of FIGS. 1 and 4 will be omitted orbriefly provided.

The semiconductor chip 10 e includes the plurality of vias 16 in thesemiconductor substrate 11. The active region ac including the wiringlayer 24 and the interlayer insulating layer 26 may be formed on thefirst surface F1 of the semiconductor substrate 11. The semiconductorchip 10 e may include the connection pad 28-1 for connecting theplurality of vias 16 on the second surface F2 of the semiconductorsubstrate 11. An external connection terminal 30, e.g., a solder bump,may be formed on the connection pad 28-1. The semiconductor chip 10 emay be mounted on an external circuit board, e.g., a printed circuitboard, via the external connection terminals 30.

FIG. 6 is a partial cross-sectional view of a semiconductor chip 10 faccording to some example embodiments of inventive concepts.

In detail, the semiconductor chip 10 f may be the same as thesemiconductor chip 10 d of FIG. 4, except that the barrier metal pad 18is further formed in the via hole ho3. Accordingly, descriptions aboutthe same elements as those of the semiconductor chips 10 a and 10 d ofFIGS. 1 and 4 will be omitted or briefly provided.

The semiconductor chip 10 e includes the plurality of vias 16 in thesemiconductor substrate 11. The upper passivation layer 14 may be formedon the lower passivation layer 12, except for the vias 16, on the firstsurface F1 of the semiconductor substrate 11. A via hole ho3 exposingthe vias 16 may be formed in the upper passivation layer 14. The bumppad 22 and the barrier metal pad 18 may be formed in the via hole ho3.The bump pad 22 may be a pad connecting the plurality of vias 16. Thebump region I may be defined by forming the bump 20 on the barrier metalpad 18.

The active region ac including the wiring layer 24 and the interlayerinsulating layer 26 may be formed on the second surface F2 of thesemiconductor substrate 11. The connection pad 28 and the externalconnection terminal 30 may be formed in the active region ac on thesecond surface F2 of the semiconductor substrate 11.

FIG. 7 is a partial cross-sectional view of a semiconductor chip 10 gaccording to some example embodiments of inventive concepts.

In detail, the semiconductor chip 10 g may be the same as thesemiconductor chip 10 f of FIG. 6, except that the semiconductor chip 10g includes redistribution wiring and dummy regions III and IV having theredistribution wiring pattern 32 and a dummy pattern 34. Descriptionsabout the same elements as those of the semiconductor chip 10 f of FIG.6 will be omitted or briefly provided.

In FIG. 7, the redistribution wiring and dummy regions III and IVincluding the redistribution wiring pattern 32 and the dummy pattern 34are shown. However, if only one of the redistribution wiring pattern 32and the dummy pattern 34 is included, the semiconductor chip 10 g mayonly include one of the redistribution wiring and dummy regions III andIV.

The semiconductor chip 10 g may include a bump region I in which a bump20 is disposed on the first surface F1 of the semiconductor substrate11. The bump region I may include vias 16, the bump pad 22, and thebarrier metal pad 18. The semiconductor chip 10 g may include theredistribution wiring and dummy regions III and IV, in which theredistribution wiring pattern 32 and the dummy pattern 34 are formed onthe lower passivation layer 12. A plurality of redistribution wiringpatterns 32 and a plurality of dummy patterns 34 may be formed.

The redistribution wiring and dummy regions III and IV may be formed ata side of the bump region I. The upper passivation layer 14 may beformed to cover the semiconductor substrate 11 in the bump region I, theredistribution wiring and the dummy regions III and IV, and the non-bumpregion II. The upper passivation layer 14 may be formed to cover theredistribution wiring patterns 32 and the dummy patterns 34 on the lowerpassivation layer 12. The upper passivation layer 14 may be divided asthe upper passivation layer 14 a-1 in the bump region I, an upperpassivation layer 14 a-3 in the redistribution wiring and dummy regionsIII and IV, and the upper passivation layer 14 b in the non-bump regionII.

The upper passivation layer 14 a-l in the bump region I may extend adistance d4 from a side wall of the bump 20 in the x-direction(horizontal direction). The upper passivation layer 14 a-1 in the bumpregion I may extend a distance d4-2 from the other side wall of the bump20 in the −x direction (horizontal direction). The upper passivationlayer 14 a-3 in the redistribution wiring and dummy regions III and IVmay extend a distance d5 from the other side wall of the bump 20 in the−x direction (horizontal direction).

The thickness t1 of the upper passivation layers 14 a-1 and 14 a-3 inthe bump region I and the redistribution wiring and dummy regions IIIand IV is thicker than the thickness t2 of the upper passivation layer14 b in the non-bump region II, and a step sh4 is generated between theredistribution wiring and dummy regions III and IV and the non-bumpregion II and the step sh2 is generated between the bump region I andthe non-bump region II.

The steps sh2 and sh4 may be obtained by forming an upper passivationmaterial layer (not shown) on the lower passivation layer 12, andperforming a photolithography on the upper passivation material layer byusing a mask, for example, a phase shift mask. The steps sh2 and sh4 maybe formed simultaneously with the forming of the via hole ho3 exposingthe vias 16. The steps sh2 and sh4 may be formed perpendicular in thez-axis direction, or may be inclined by a desired (and/or alternativelypredetermined) angle.

The active region ac including the wiring layer 24 and the interlayerinsulating layer 26 may be formed on the second surface F2 of thesemiconductor substrate 11. The connection pad 28 and the externalconnection terminal 30 may be formed in the active region ac on thesecond surface F2 of the semiconductor substrate 11.

FIG. 8 is a partial cross-sectional view of a semiconductor chip 10 haccording to some example embodiments of inventive concepts.

In detail, the semiconductor chip 10 h may be the same as thesemiconductor chip 10 g of FIG. 7, except that the semiconductor chip 10h includes the redistribution wiring and dummy regions III and IV havingan exposed redistribution wiring pattern 32 and the dummy pattern 34 andan upper passivation layer 14 b-2 having a recess portion 36 in thenon-bump region II. Accordingly, descriptions about the same elements asthose of the semiconductor chip 10 g of FIG. 7 may be omitted or brieflyprovided.

The semiconductor chip 10 h may include the redistribution wiring regionIII and the dummy region IV, in which the redistribution wiring pattern32 and the dummy pattern 34 are formed on the lower passivation layer12. The upper passivation layer 14 may be formed on the lowerpassivation layer 12 and cover the bump region I, the redistributionwiring and dummy regions III and IV, and the non-bump region II of thesemiconductor substrate 11. The upper passivation layer 14 a-3 in theredistribution wiring and dummy regions III and IV may be recessed toexpose the redistribution wiring pattern 32 and the dummy pattern 34.Accordingly, a step sh5 is generated between the redistribution wiringand dummy regions HI and IV and the bump region I.

The recess portion 36 may be formed in the upper passivation layers 14b-2 in the non-bump region II. The recess portion 36 in the non-bumpregion II may be formed when the recess in the upper passivation layer14 a-3 in the redistribution wiring and dummy regions III and IV isformed. A thickness t5 of the upper passivation layers 14 a-3 and 14 b-2in the redistribution wiring and dummy regions III and IV and thenon-bump region II may be thinner than the thickness t1 of the upperpassivation layer 14 a-1. In addition, the step sh2 is formed betweenthe bump region I and the non-bump region II. The steps sh2 may beformed perpendicular in the z-axis direction, or may be inclined by adesired (and/or alternatively predetermined) angle.

FIG. 9 is a partial cross-sectional view of a semiconductor chip 10 iaccording to some example embodiments of inventive concepts.

In detail, the semiconductor chip 10 i may be the same as thesemiconductor chip 10 e of FIG. 5, except that the bump pad 22, the bump20, and the upper passivation layer 14 are formed on the second surfaceF2 of the semiconductor substrate 11 without forming a via. Accordingly,descriptions about the same elements as those of the semiconductor chip10 e of FIG. 5 may be omitted or briefly provided.

The semiconductor chip 10 i may include the active region ac includingthe wiring layer 24 and the interlayer insulating layer 26 on the secondsurface F2 of the semiconductor substrate 11. In the semiconductor chip10 i, the upper passivation layer 14 may be formed on the lowerpassivation layer 12 on the second surface F2 of the semiconductorsubstrate 11. The bump pad 22 may be formed in a hole ho5 in the upperpassivation layer 14. The bump pad 22 may be connected to a chip pad(not shown) formed on the second surface F2 of the semiconductorsubstrate 11. The bump region I may be obtained by forming the bump 20on the bump pad 22.

The upper passivation layer 14 may be formed on the lower passivationlayer 12 and cover the bump region I and the non-bump region II in thesemiconductor substrate 11, except for the bump pad 22 and the bump 20.The upper passivation layer 14 may be divided as an upper passivationlayer 14 a in the bump region I and an upper passivation layer 14 b inthe non-bump region II.

In addition, the thickness t1 of the upper passivation layer 14 a in thebump region I is thicker than the thickness t2 of the upper passivationlayer 14 b in the non-bump region II, and the step sh2 is generatedbetween the bump region I and the non-bump region 1I. The step sh2 maybe formed perpendicular in the z-axis direction, or may be inclined by adesired (and/or alternatively predetermined) angle.

FIG. 10 is a partial cross-sectional view of a semiconductor chip 10 jaccording to some example embodiments of inventive concepts.

In detail, the semiconductor chip 10 j may be the same as thesemiconductor chip 10 g of FIG. 7, except that the bump pad 22, thebarrier metal pad 18, the bump 20, the redistribution wiring pattern 32,the dummy pattern 34, and the upper passivation layer 14 are formed onthe second surface F2 of the semiconductor substrate 11, without forminga via. Accordingly, descriptions about the same elements as those of thesemiconductor chip 10 g of FIG. 7 may be omitted or briefly provided.

The semiconductor chip 10 j may include the active region ac includingthe wiring layer 24 and the interlayer insulating layer 26 on the secondsurface F2 of the semiconductor substrate 11. In the semiconductor chip10 j, the upper passivation layer 14 may be formed on the lowerpassivation layer 12 on the second surface F2 of the semiconductorsubstrate 11. The bump pad 22 and the barrier metal pad 18 may be formedin the upper passivation layer 14. The bump pad 22 may be connected to achip pad (not shown) formed on the second surface F2 of thesemiconductor substrate 11. The bump region I may be defined by formingthe bump 20 on the bump pad 22 and the barrier metal pad 18.

The upper passivation layer 14 may be formed on the lower passivationlayer 12 and cover the bump region I, the non-bump region II, and theredistribution wiring and dummy regions III and IV in the semiconductorsubstrate 11, except for the bump pad 22, the barrier metal pad 18, andthe bump 20. The upper passivation layer 14 may be divided as the upperpassivation layer 14 a-1 in the bump region I, the upper passivationlayer 14 b in the non-bump region II, and the upper passivation layer 14a-3 in the redistribution wiring and dummy regions III and IV.

In addition, the thickness t1 of the upper passivation layers 14 a-1 and14 a-3 in the bump region I and the redistribution wiring and dummyregions III and IV is thicker than the thickness t2 of the upperpassivation layer 14 b in the non-bump region II. The step sh4 isgenerated between the redistribution wiring and dummy regions III andIV, and the non-bump region II. The step sh2 is generated between thebump region I and the non-bump region II. The steps sh2 and sh4 may beformed perpendicular in the z-axis direction, or may be inclined by adesired (and/or alternatively predetermined) angle.

FIG. 11 is a partial cross-sectional view of a semiconductor chip 10 kaccording to some example embodiments of inventive concepts.

In detail, the semiconductor chip 10 k may be the same as thesemiconductor chip 10 h of FIG. 8, except that the bump pad 22, thebarrier metal pad 18, the bump 20, the redistribution wiring pattern 32,the dummy pattern 34, and the upper passivation layer 14 are formed onthe second surface F2 of the semiconductor substrate 11, without forminga via. Accordingly, descriptions about the same elements as those of thesemiconductor chip 10 h of FIG. 8 may be omitted or briefly provided.

The semiconductor chip 10 k may include the active region ac includingthe wiring layer 24 and the interlayer insulating layer 26 on the secondsurface F2 of the semiconductor substrate 11. In the semiconductor chip10 k, the upper passivation layer 14 may be formed on the lowerpassivation layer 12 on the second surface F2 of the semiconductorsubstrate 11. The bump pad 22 and the barrier metal pad 18 may be formedin the upper passivation layer 14. The bump pad 22 may be connected to achip pad (not shown) formed on the second surface F2 of thesemiconductor substrate 11. The bump region I may be defined by formingthe bump 20 on the bump pad 22 and the barrier metal pad 18.

The upper passivation layer 14 may be formed on the lower passivationlayer 12 and cover the bump region I, the non-bump region II, and theredistribution wiring and dummy regions III and IV in the semiconductorsubstrate 11, except for the bump pad 22, the barrier metal pad 18, andthe bump 20.

The upper passivation layer 14 may be divided as the upper passivationlayer 14 a-1 in the bump region I, the upper passivation layer 14 b-2 inthe non-bump region II, and the upper passivation layer 14 a-3 in theredistribution wiring and dummy regions III and IV.

The thickness t1 of the upper passivation layer 14 a-1 in the bumpregion I may be thicker than the thickness t5 of the upper passivationlayers 14 b-2 and 14 a-3 in the non-bump region II and theredistribution wiring and dummy regions III and IV. The step sh5 isgenerated between the bump region I and the redistribution wiring anddummy regions III and IV. The step sh2 is generated between the bumpregion I and the non-bump region II. The steps sh2 and sh5 may be formedperpendicular in the z-axis direction, or may be inclined by a desired(and/or alternatively predetermined) angle.

FIGS. 12 and 13 are plan views partially showing semiconductor chips 40a and 40 b for illustrating a relationship between thicknesses of a bumpand a passivation layer, according to some example embodiments ofinventive concepts.

In detail, the semiconductor chips 40 a and 40 b illustrated in thepartial plan views of FIGS. 12 and 13 may include bumps 20 spaced apartfrom one another on the semiconductor substrate 11. The bumps 20 may bearranged as a honeycomb shape as shown in FIGS. 12 and 13. The bumps 20may be aligned in the horizontal (x direction) and the verticaldirection (y direction).

The passivation layer 14 a forming the bump region I may be formedaround the bumps 20, as described above. In addition, the passivationlayer 14 b forming the non-bump region II is formed on the semiconductorsubstrate 11, except for the bump region I.

In the semiconductor chip 40 a of FIG. 12, the thickness of thepassivation layer 14 a surrounding the plurality of bumps 20 isconfigured to be thicker than that of the passivation layer 14 b in thenon-bump region II. In the semiconductor chip 40 b of FIG. 13, thethickness of the passivation layer 14 a surrounding only some of theplurality of bumps 20 is configured to be thicker than that of thepassivation layer 14 b in the non-bump region II. As described above,the thickness of the passivation layer surrounding the bumps 20 on thesemiconductor substrate 11 may be freely adjusted to control the warpageof the semiconductor chip.

FIG. 14 is a partial plan view of a semiconductor chip 40 c forillustrating a relationship between thicknesses of a bump and apassivation layer, according to some example embodiments of inventiveconcepts.

In detail, the semiconductor chip 40 c illustrated in the partial planview of FIG. 14 may include the bumps 20 that are spaced from oneanother on the semiconductor substrate 11. The semiconductor substrate11 may be divided as a center region 42 formed at a center portionthereof, and a peripheral region 44 surrounding the center region 42 andseparated from the center region 42. An isolation region 41 may belocated between the center region 42 and the peripheral region 44.

The passivation layer 14 a forming the bump region I may be formedaround the bumps 20, as described above. In addition, the passivationlayer 14 b forming the non-bump region II is formed on the semiconductorsubstrate 11, except for the bump region I.

In the partial plan view of FIG. 14, the thickness of the passivationlayer 14 a surrounding all of the plural bumps 20 formed on the centerregion 42 is thicker than that of the passivation layer 14 b in thenon-bump region II. As illustrated above with reference to FIG. 13, thethickness of the passivation layer 14 a surrounding some of the pluralbumps 20 formed on the center region 42 may be only configured to bethicker than that of the passivation layer 14 b in the non-bump regionII.

In the partial plan view of FIG. 14, the thickness of the passivationlayer 14 b surrounding the plurality of bumps formed on the peripheralregion 44 is configured to be thinner than that of the passivation layer14 a in the bump region I. As described above, by freely adjusting thethickness of the passivation layers 14 a and 14 b surrounding the bumps20 on the semiconductor substrate 11, the warpage of the semiconductorchip may be controlled.

FIG. 15 is a partial plan view of a semiconductor chip 40 d forillustrating a relationship between thicknesses of a bump and apassivation layer, according to some example embodiments of inventiveconcepts.

In detail, the semiconductor chip 40 d illustrated in the partial planview of FIG. 15 may include the bumps 20 that are spaced from oneanother on the semiconductor substrate 11. The semiconductor substrate11 may be divided as a plurality of sub-regions 60, 62, 64, 66, 68, and70 that are partitioned from one side towards the other side.

The passivation layer 14 a forming the bump region I may be formedaround the bumps 20, as described above. In addition, the passivationlayer 14 b forming the non-bump region II is formed on the semiconductorsubstrate 11, except for the bump region I.

In the partial plan view of FIG. 15, the thickness of the passivationlayer 14 a surrounding some of the plural bumps 20 formed on at leastone of the sub-regions 60, 62, 64, 66, 68, and 70 is thicker than thatof the passivation layer 14 b in the non-bump region II. As illustratedabove with reference to FIG. 12, the thickness of the passivation layer14 a surrounding all of the plural bumps 20 formed on at least one ofthe sub-regions 60, 62, 64, 66, 68, and 70 may be thicker than that ofthe passivation layer 14 b in the non-bump region II.

In the partial plan view of FIG. 15, the thickness of the passivationlayer 14 b surrounding the plurality of bumps 20 formed on at least oneof the sub-regions 60, 62, 64, 66, 68, and 70 is thinner than that ofthe passivation layer 14 a in the bump region I. As described above, byfreely adjusting the thickness of the passivation layers 14 a and 14 bsurrounding the bumps 20 on the semiconductor substrate 11, the warpageof the semiconductor chip may be controlled.

FIG. 16 is a cross-sectional view of a semiconductor package 1000including a semiconductor chip according to some example embodiments,and FIG. 17 is a partially enlarged view showing a part of FIG. 16.

In particular, FIG. 17 is an enlarged view of a part C in FIG. 16. Thesemiconductor package 1000 according to the embodiment of the inventiveconcept may include a first semiconductor chip 100, a secondsemiconductor chip 200, and an upper semiconductor chip 500. Asdescribed above, the first semiconductor chip 100, the secondsemiconductor chip 200, and the upper semiconductor chip 500 may eachinclude the bump region I including bumps 194 a and 194 b, theredistribution wiring and dummy regions III and IV includingredistribution wiring patterns 196 a and 197 a and dummy patterns 196 band 197 b, and the non-bump region II not including a bump.

The first semiconductor chip 100 may include one or more first vias 174a penetrating through a first semiconductor substrate 102 a. The firstvia 174 a protrudes from an upper surface of the first semiconductorsubstrate 102 a, and a side surface of the first via 174 a may besurrounded by a lower passivation layer 124 a formed on the uppersurface of the first semiconductor substrate 102 a.

The second semiconductor chip 200 is disposed on the first semiconductorchip 100. The second semiconductor chip 200 may be bonded to the firstsemiconductor chip 100 by a thermo-compression bonding process. Thesecond semiconductor chip 200 includes one or more second via 174 barranged along the same vertical line as that of the first via 174 a inthe first semiconductor chip 100. The second via 174 b protrudes from anupper surface of a second semiconductor substrate 102 b, and a sidesurface of the second via 174 b may be surrounded by a lower passivationlayer 124 b formed on the upper surface of the second semiconductorsubstrate 102 b.

A plurality of bump pads 192 a and 192 b may be respectively formed onan upper surface of the first via 174 a in the first semiconductor chip100 and on an upper surface of the second via 174 b in the secondsemiconductor chip 200. The bump pads 192 a and 192 b may include metal.The redistribution wiring patterns 196 a and 197 a and the dummypatterns 196 b and 197 b having the same height as that of the bump pads192 a and 192 b may be formed on the upper surfaces of the firstsemiconductor chip 100 and the second semiconductor chip 200. Theredistribution wiring patterns 196 a and 197 a and the dummy patterns196 b and 197 b may include the same material as the bump pads 192 a and192 b, for example, metal.

As shown in the enlarged view of FIG. 17, the bump pad 192 a, theredistribution wiring pattern 196 a, and the dummy pattern 197 a of thefirst semiconductor chip 100 may be embedded or covered by the upperpassivation layer 178 a. Like the first semiconductor chip 100, the bumppad 192 b, the redistribution wiring pattern 196 b, and the dummypattern 197 b of the second semiconductor chip 200 may be covered orembedded by the second upper passivation layer 178 b.

A thickness of a first upper passivation layer 178 a-1 in the bumpregion I and the redistribution wiring and dummy regions III and IV ofthe first semiconductor chip 100 may be thicker than that of a firstupper passivation layer 178 a-2 in the non-bump region II. Likewise, athickness of the second upper passivation layer 178 b in theredistribution wiring and dummy regions III and IV of the secondsemiconductor chip 200 may be thicker than that of the second upperpassivation layer 178 b in the non-bump region II.

The upper semiconductor chip 500 is disposed on the second semiconductorchip 200. The upper semiconductor chip 500 may be bonded to the secondsemiconductor chip 200 by a thermo-compression bonding process. Theupper semiconductor chip 500 may be thicker than the first semiconductorchip 100 and the second semiconductor chip 200 in thickness.

The second semiconductor chip 200 is electrically connected to the firstsemiconductor chip 100 via connection pads 170 b and bumps 194 a formedon a lower surface of the second semiconductor chip 200 and bump pads192 a formed on the upper surface of the first semiconductor chip 100.The upper semiconductor chip 500 is electrically connected to the secondsemiconductor chip 200 via connection pads 170 c and bumps 194 b formedon a lower surface of the upper semiconductor chip 500 and bump pads 192b formed on the upper surface of the second semiconductor chip 200.

The first semiconductor chip 100 and the second semiconductor chip 200may be semiconductor chips of the same kind. The semiconductor package1000 may include a first underfill material 198 a filling a spacebetween the first semiconductor chip 100 and the second semiconductorchip 200. The semiconductor package 1000 may include a second underfillmaterial 198 b filling a space between the second semiconductor chip 200and the upper semiconductor chip 500. The first underfill material 198 aand the second underfill material 198 b may include a non-conductivematerial, for example, a non-conductive film (NCF).

FIG. 18 is a partially enlarged cross-sectional view of thesemiconductor package 1000 of FIG. 16.

In detail, FIG. 18 is a partially enlarged cross-sectional view of thefirst semiconductor chip 100 of FIG. 16. The first semiconductor chip100 may include a semiconductor substrate 102 a having the first surfaceF1 and the second surface F2, a lower interlayer insulating layer 104,an integrated circuit layer 150, vias 174 a, an upper interlayerinsulating layer 122, a lower passivation layer 124 a, and amulti-layered wiring pattern 180.

The integrated circuit layer 150 may be formed on the first surface F1of the semiconductor substrate 102 a. Doping regions on which impuritiesare doped may be formed on an upper region of the semiconductorsubstrate 102 a, which is adjacent to the first surface F1 where theintegrated circuit layer 150 is formed. On the other hand, a lowerregion of the semiconductor substrate 102 a adjacent to the secondsurface F2 may be an undoped region.

The lower interlayer insulating layer 104 may be formed over the firstsurface F1 of the semiconductor substrate 102 a while covering theintegrated circuit layer 150. The lower interlayer insulating layer 104may isolate circuit devices in the integrated circuit layer 150 from oneanother. In addition, the lower interlayer insulating layer 104 mayisolate circuit devices in the multi-layered wiring pattern 180 and theintegrated circuit layer 150 from one another. The lower interlayerinsulating layer 104 may have a stack structure including one or moreselected from an oxide layer, a nitride layer, a low-k layer, and ahigh-k layer.

The integrated circuit layer 150 may be formed in the lower interlayerinsulating layer 104 on the first surface F1 of the semiconductorsubstrate 102 a, and may include a plurality of circuit devices. Theintegrated circuit layer 150 may include the circuit devices, forexample, transistors and/or capacitors, according to a kind of thesemiconductor chip 100.

According to the structure of the integrated circuit layer 150, thefirst and second semiconductor chips 100 and 200 may function as memorydevices or logic devices.

For example, the memory device may include dynamic random access memory(DRAM), static RAM (SRAM), a flash memory, electrically erasable andprogrammable read only memory (EEPROM), PRAM, MRAM, or RRAM. Such astructure of the semiconductor device is generally known in the art, andthus, does not restrict the scope of the inventive concept. Here, thereference numeral 152 may denote a metal contact that electricallyconnects the circuit devices in the integrated circuit layer 150 toabove wiring patterns.

The upper interlayer insulating layer 122 may be provided on the lowerinterlayer insulating layer 104 to cover the multi-layered wiringpattern 180. The upper interlayer insulating layer 122 may separatewiring lines 181, 183, 185, and 187 from one another.

The lower passivation layer 124 a may protect the upper surface of thesemiconductor chip 100. The lower passivation layer 124 a may include anoxide layer or a nitride layer, or a dual-layer including the oxidelayer and the nitride layer. The upper passivation layer 178 a may beformed on the lower passivation layer 124 a. The upper passivation layer178 a may be thicker in thickness in the bump region including the bumps194 a, and may be thinner in thickness in a non-bump region excludingthe bumps 194 a.

The multi-layered wiring pattern 180 may be formed in the lowerinterlayer insulating layer 104 and the upper interlayer insulatinglayer 122, and may be electrically connected to the via 174 a. Themulti-layered wiring pattern 180 may include at least one layer ofwiring lines, and vertical contacts connecting the wiring lines. Themulti-layered wiring pattern 180 may be used to configure a desired(and/or alternatively predetermined) circuit by appropriately connectingthe circuit devices in the integrated circuit layer 150 or to connectthe circuit devices to an external product.

In some example embodiments, wiring lines of three layers, for example,the first wiring line 181, the second wiring line 185, and the thirdwiring line 189, may be arranged, and a first vertical plug 183connecting the first wiring line 181 to the second wiring line 185 and asecond vertical plug 187 connecting the second wiring line 185 to thethird wiring line 189 may be formed. The first to third wiring lines181, 185, and 189 and the first and second vertical plugs 183 and 187 inthe multi-layered wiring pattern 180 may include the same material, forexample, copper or aluminum, or may include different materials.

The via 174 a in the first semiconductor chip 100 of FIG. 18 may includea via insulating layer 135, a barrier metal layer 134, and a wiringmetal layer 132. The barrier metal layer 134 may include a stackstructure having one or more selected from titanium (Ti), tantalum (Ta),titanium nitride (TiN), and tantalum nitride (TaN).

The wiring metal layer 132 may include one or more selected fromaluminum (Al), gold (Au), beryllium (Be), bismuth (Bi), cobalt (Co),copper (Cu), hafnium (Hf), indium (In), manganese (Mn), molybdenum (Mo),nickel (Ni), lead (Pb), palladium (Pd), platinum (Pt), rhodium (Rh),rhenium (Re), ruthenium (Ru), tantalum (Ta), tellurium (Te), titanium(Ti), tungsten (W), zinc (Zn), and zirconium (Zr). The wiring metallayer 132 may have a stack structure including one or more selected fromtungsten (W), aluminum (Al), and copper (Cu).

The via 174 a penetrates through the interlayer insulating layers 104and 122, the lower passivation layer 124 a, and the semiconductorsubstrate 102 a, and an end of the via 174 a may be exposed from thesecond surface F2 of the semiconductor substrate 102 a. The via 174 amay protrude from the second surface F2 of the semiconductor substrate102 a to be easily connected to the connection pad 170 a.

The bump pad 192 a and the bump 194 a may be formed on the via 174 a.The bump 194 a may be connected to the via 174 a, and may be connectedto the multi-layered wiring pattern 180. A protective layer 106 may beformed on the second surface F2 of the semiconductor substrate 102 a inorder to protect devices.

FIG. 19 is a cross-sectional view of a semiconductor package 1000-1including a semiconductor chip according to some example embodiments ofinventive concepts.

In detail, the semiconductor package 1000-1 according to the embodimentmay be the same as the semiconductor package 1000 of FIG. 16, exceptthat the semiconductor package 1000-1 is mounted on a printed circuitboard 600. In FIG. 19, the reference numeral 610 may be an adhesivelayer.

The semiconductor package 1000-1 may include first to fourthsemiconductor chips 100, 200, 300, and 400 and the upper semiconductorchip 500 mounted on the printed circuit board 600. Since the first tofourth semiconductor chips 100 to 400 are similar to the semiconductorchips 100 and 200 illustrated with reference to FIGS. 16 to 18,descriptions about them may be omitted or briefly provided. The uppersemiconductor chip 500 is similar to the upper semiconductor chip 500 ofFIG. 16, and thus, descriptions thereof may be omitted.

The first semiconductor chip 100 may be electrically connected to theprinted circuit board 600 via connection pads 170 a formed on a lowersurface thereof, and connection terminal 604 and substrate pads 606.External connection terminals 608 may be formed on a lower surface ofthe printed circuit board 600.

FIG. 20 is a cross-sectional view of a semiconductor package 1000-2including a semiconductor chip according to some example embodiments,and FIG. 21 is a partially enlarged view showing a part of FIG. 20.

In detail, the semiconductor package 1000-2 may have a structure, inwhich a semiconductor chip 720 is directly mounted on a printed circuitboard 700 via bumps 730. The semiconductor package 1000-2 mayselectively include an underfill unit 750 filling a space between thesemiconductor chip 720 and the printed circuit board 700. Thesemiconductor package 1000-2 may selectively further include anencapsulation unit 740 for encapsulating the semiconductor chip 720mounted on the printed circuit board 700, and external connectionterminals 780 for extending functions of the semiconductor chip 720 tooutside at a lower portion of the printed circuit board 700. Theexternal connection terminals 780 may be formed on the substrate pads760.

The bumps 730 may denote conductive protrusions that are used to bondthe semiconductor chip 720 to the printed circuit board 700 by a tapeautomated bonding (TAB) process or a flip-chip bonding process. Thebumps 730 may be used as conductive protrusions for directly connectinga ball grid array (BGA), a chip scale package (CSP), etc. to the printedcircuit board 700. If the bumps 730 are solder bumps, the bump 730 maymaintain a ball shape due to a surface tension effect after a reflowprocess, but if the bumps 730 are gold (Au) bumps, the bump 730 may beformed as square pillars that are plated. The bump 730 may include ametal material such as solder, gold (Au), and copper (Cu).

FIG. 21 may be an enlarged view of the reference numeral 770 in FIG. 20.As shown in FIG. 21, the bumps 730 may be formed on bump pads 726 formedin a passivation layer 724 on the semiconductor chip 720. Thepassivation layer 724 may be divided as a passivation layer 724 a in thebump region including the bumps 730 and a peripheral portion, and apassivation layer 724 b in a non-bump region excluding the bump region.

The passivation layer 724 a in the bump region is thicker in thicknessthan the passivation layer 724 b in the non-bump region, and a step maybe generated between the bump region and the non-bump region.Accordingly, by reducing the thickness of the passivation layer in thenon-bump region, except for the region surrounding the bumps 730,generation of warpage in the semiconductor chip 720 or the semiconductorpackage 1000-2 may be restricted.

FIG. 22 is a cross-sectional view of a semiconductor package 1000-3including a semiconductor chip according to some example embodiments ofinventive concepts.

In detail, the semiconductor package 1000-3 of FIG. 22 may be asystem-in-package (SIP) of a package-on-package (POP) type, in which aplurality of the semiconductor packages 1000-2 of FIG. 20 are mounted.Accordingly, descriptions about the same elements as those shown inFIGS. 20 and 21 will be omitted or briefly provided.

The semiconductor package 1000-3 may be a package, in which a secondsemiconductor package 1000-2 b is stacked on a first semiconductorpackage 1000-2 a. The first semiconductor package 1000-2 a may include afirst semiconductor chip 720 a mounted on a first printed circuit board700 a. The second semiconductor package 1000-2 b may include a secondsemiconductor chip 720 b mounted on a second printed circuit board 700b. The first and second semiconductor chips 720 a and 720 b may berespectively connected to the first and second printed circuit boards700 a and 700 b via bumps 730. The bumps 730 are formed on the first andsecond semiconductor chips 720 a and 720 b, and have the samecross-section as that of FIG. 21, and thus, descriptions thereof areomitted.

The second semiconductor package 1000-2 b may be connected to upperconnection pads 765 of the first printed circuit board 700 a via lowerconnection pads 760 b and connection terminals 780 b formed on a lowersurface of the second printed circuit board 700 b. The firstsemiconductor package 1000-2 a may be connected to an external devicevia lower connection pads 760 a and connection terminals 780 a formed ona lower surface of the first printed circuit board 700 a.

While some example embodiments of inventive concepts have beenparticularly shown and described, it will be understood that variouschanges in form and details may be made therein without departing fromthe spirit and scope of the following claims.

1. A semiconductor chip comprising: a semiconductor substrate includinga bump region and a non-bump region; a bump on the bump region, thenon-bump region having no bump; and a passivation layer on the bumpregion and the non-bump region of the semiconductor substrate, athickness of the passivation layer at the bump region being thicker thana thickness of the passivation layer at the non-bump region, and thepassivation layer including a step between the bump region and thenon-bump region.
 2. The semiconductor chip of claim 1, furthercomprising: a lower passivation layer below the passivation layer,wherein the passivation layer is an upper passivation layer.
 3. Thesemiconductor chip of claim 1, wherein the passivation layer includesone an oxide layer, a nitride layer, and a photo-sensitive organiclayer.
 4. The semiconductor chip of claim 1, wherein the bump regionextends a distance from opposite side walls of the bump in a horizontaldirection.
 5. The semiconductor chip of claim 1, further comprising: abarrier metal pad on the bump region, wherein the bump is on the barriermetal pad.
 6. The semiconductor chip of claim 1, further comprising: abump pad on the bump region; and a barrier metal pad on the bump pad,wherein the bump is on the barrier metal pad.
 7. (canceled)
 8. Thesemiconductor chip of claim 1, wherein the passivation layer includes arecess portion in the non-bump region.
 9. The semiconductor chip ofclaim 1, wherein the semiconductor substrate includes a first surfaceand a second surface opposite the first surface, and one of the firstsurface and the second surface of the semiconductor substrate includesthe active region.
 10. (canceled)
 11. (canceled)
 12. The semiconductorchip of claim 1, further comprising: a plurality of bumps that arespaced apart from one another on the bump region of the semiconductorsubstrate, wherein the plurality of bumps include the bump, and thethickness of the passivation layer surrounding some of the plurality ofbumps is thicker than the thickness of the passivation layer in thenon-bump region.
 13. The semiconductor chip of claim 1, furthercomprising: a plurality of bumps that are spaced apart from one anotheron the bump region of the semiconductor substrate, wherein thesemiconductor substrate includes a center region and a peripheral regionisolated from the center region and surrounding the center region, andthe thickness of the passivation layer surrounding some or all of theplurality of bumps in the center region is thicker than the thickness ofthe passivation layer in the non-bump region.
 14. The semiconductor chipof claim 1, further comprising: a plurality of bumps that are spacedapart from one another on the bump region of the semiconductorsubstrate, wherein an upper surface of the semiconductor substrateincludes a plurality of sub-regions that are isolated from one anotherin a direction from a first side to a second side of the semiconductorsubstrate, and the thickness of the passivation layer surrounding someor all of the plurality of bumps in at least one of the sub-regions isthicker than the thickness of the passivation layer in the non-bumpregion.
 15. The semiconductor chip of claim 1, further comprising: a viain the bump region. 16.-25. (canceled)
 26. A semiconductor chipcomprising: a semiconductor substrate including a first surface oppositea second surface, the semiconductor substrate including a bump region, anon-bump region, a redistribution wiring region, and a dummy region; abump pad on the first surface of the substrate in the bump region; abump on the bump pad, the non-bump region having no bump; at least oneof a redistribution wiring pattern on the redistribution wiring regionand a dummy pattern on the dummy region, the at least one of theredistribution wiring pattern and the dummy pattern being on the firstsurface or the second surface of the semiconductor substrate; and apassivation layer covering the bump region, the non-bump region, and theredistribution wiring and dummy regions on the first surface or thesecond surface of the semiconductor substrate, a thickness of thepassivation layer at the bump region being thicker than a thickness ofthe passivation layer at the non-bump region, and the passivation layerincluding a first step between the bump region and the non-bump region.27. The semiconductor chip of claim 26, wherein a thickness ofredistribution wiring pattern and the dummy pattern is equal to athickness of the bump pad, and the passivation layer covers theredistribution wiring pattern and the dummy pattern.
 28. Thesemiconductor chip of claim 26, wherein a thickness of the passivationlayer in the redistribution wiring and dummy regions is thicker than athickness of the passivation layer in the non-bump region, and thepassivation layer includes a second step between the non-bump region andthe redistribution wiring and dummy regions. 29.-35. (canceled)
 36. Asemiconductor chip comprising: a semiconductor substrate including afirst surface opposite a second surface; a bump connected to one of thefirst surface and the second surface; a passivation layer on thesemiconductor substrate and extending along the one of the first surfaceand the second surface of the semiconductor substrate, the passivationlayer including a first portion having a first thickness, a secondportion having a second thickness that is less than the first thickness,and a step defining the first portion and the second portion, and thefirst portion of the passivation layer defining a hole between the bumpand the semiconductor substrate.
 37. The semiconductor chip of claim 36,wherein the bump is a connection terminal for electrically connectingthe semiconductor chip to another semiconductor chip or an externalsemiconductor chip, and no bump is on a portion of the semiconductorsubstrate covered by the second portion of the passivation layer. 38.The semiconductor chip of claim 36, further comprising: a lowerpassivation layer between the passivation layer and the semiconductorsubstrate, wherein a thickness of the lower passivation layer is thesame along the first portion of passivation layer and the second portionof the passivation layer, and the passivation layer is an upperpassivation layer.
 39. The semiconductor chip of claim 38, wherein thelower passivation layer includes at least one of an oxide layer and anitride layer, and the upper passivation layer includes at least oneoxide layer, a nitride layer, and an organic layer.
 40. Thesemiconductor chip of claim 36, further comprising: a via extendingthrough the semiconductor substrate; and at least one of a bump pad anda barrier metal pad on the via, wherein the bump is electricallyconnected to the via through the at least one of the bump pad and thebarrier metal pad.